poEuropeanprojectionWLCSP24: wafer level chip-size package; 24 bumps (5 x 5 - A1)

原创
04/25 00:00
阅读数 18

wlcsp25_217x232_po Package outline © 2010 NXP B.V. All rights reserved. Reproduction in whole or in part is prohibited without prior consent of the copyright owner. The information presented

展开阅读全文
加载中
点击引领话题📣 发布并加入讨论🔥
打赏
0 评论
0 收藏
0
分享
返回顶部
顶部